Shannon Davis / Solid State Technology
EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Pho – The collaboration will leverage EVGs nanoimprint lithography (NIL) technology, expertise and services with Teramounts PhotonicPlug technology. EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits was posted by Shannon Davis on Semiconductor Digest. EV Group (EVG), a supplier of wafer bonding and lithography equipment …
