QFN packaging increasingly adopted for B2B networking chips (Willis Ke/DigiTimes: IT news from Asia)

Willis Ke / DigiTimes: IT news from Asia
QFN packaging increasingly adopted for B2B networking chips – Taiwan suppliers of B2B networking chips are moving to adopt QFN technology for packing their products amid the growing shortage of substrates for FC (flip-chip) production, increasing business opportunities for their local backend partners including ASE Technology, Greatek Electronics, and Chang Wah Technology, according to industry sources. …

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